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Wafer bonding
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21	F R A U N HO F E R I N S T I T U T e F o R E l ectr o n i c N a n o S y stems E N A S i n c o o per a t i o n w i t h Fraunhofer Project Center NEMS/MEMS devices and manufacturing Add to Reading List Source URL: www.enas.fraunhofer.de Language: English - Date: 2015-01-15 09:23:12 Microtechnology Electronics manufacturing Fraunhofer Society Laboratories Microelectromechanical systems Wafer bonding Masayoshi Esashi Fraunhofer Group for Microelectronics Microsystem Technologies Materials science Technology Electromagnetism
22	F R A U N H O F E R re s ear c h i n s t i t u t i on for e l e c t ron i c nano s y s t e m s E N A S Annual Report 2008 Add to Reading List Source URL: www.enas.fraunhofer.de Language: English - Date: 2015-01-16 05:30:03 Science Technology Joseph von Fraunhofer Chemistry Wafer bonding Fraunhofer Additive Manufacturing Alliance Claudia Kemfert Fraunhofer Society Laboratories Fraunhofer Group for Microelectronics
23	F r a u n h o f e r I n s t i t u t e f o r E l e c t r o n i c n a n o s y s t e m s ENAS SMART SYSTEMS Visions becOme Reality 1 Add to Reading List Source URL: www.enas.fraunhofer.de Language: English - Date: 2015-01-16 02:56:29 Science Microelectromechanical systems RF MEMS Fraunhofer Society Micro-Opto-Electro-Mechanical Systems Wafer bonding Smart system Nanotechnology Microsystem Materials science Microtechnology Technology
24	SEMI-FINISHED BONDED SUBSTRATES CONSISTING OF PHOTOSENSITIVE FOTURAN® AND BOROFLOAT 33® Contact Add to Reading List Source URL: www.enas.fraunhofer.de Language: English - Date: 2015-01-16 02:49:38 Electronics manufacturing Wafer bonding Wafer Anodic bonding Direct bonding Semiconductor device fabrication 100 micrometres 10 micrometres 1 micrometre Microtechnology Electronics Technology
25	SEMI-FINISHED BONDED SUBSTRATES CONSISTING OF PIEZO- AND PYROELECTRIC LITHIUMTANTALAT AND GLASS Materials Add to Reading List Source URL: www.enas.fraunhofer.de Language: English - Date: 2015-01-16 02:26:59 Electronics manufacturing Wafer bonding Semiconductor device fabrication Wafer Direct bonding Pyroelectricity Microtechnology Technology Electronics
26	FRAUNHOFER CAM IS A COMPETENCE CENTER FOR MICROSTRUCTURE DIAGNOSTICS A N D M AT E R I A L C H A R A C T E R I Z AT I O N WITHIN FRAUNHOFER IWM IN HALLE FRAUNHOFER CENTER Add to Reading List Source URL: www.iwm.fraunhofer.de Language: English - Date: 2014-05-19 10:54:40 Electron microscopy Failure Failure analysis Maintenance Problem solving Reliability engineering Wafer bonding Electron microscope Microscopy Scientific method Science Chemistry
27	FRAUNHOFER CAM IS A COMPETENCE CENTER FOR MICROSTRUCTURE DIAGNOSTICS A N D M AT E R I A L C H A R A C T E R I Z AT I O N WITHIN FRAUNHOFER IWM IN HALLE FRAUNHOFER CENTER Add to Reading List Source URL: www.iwm.fraunhofer.de Language: English - Date: 2014-05-20 04:28:47 Materials science Semiconductors Electronics manufacturing Failure Electronic design Reliability Wafer bonding Wire bonding Microelectromechanical systems Technology Microtechnology Semiconductor device fabrication
28	SEMI-FINISHED BONDED SUBSTRATES CONSISTING OF LITHIUMTANTALATE AND SILICON Silicon Add to Reading List Source URL: www.enas.fraunhofer.de Language: English - Date: 2015-01-15 14:05:56 Electronics manufacturing Wafer bonding Semiconductor device fabrication Wafer Direct bonding Anodic bonding Microtechnology Electronics Technology
29	SCREEN PRINTING FOR MEMS PACKAGING AND WAFER BONDING Contact Add to Reading List Source URL: www.enas.fraunhofer.de Language: English - Date: 2015-01-15 11:24:45 Semiconductor device fabrication Electronics manufacturing Printmaking Wafer Microelectromechanical systems Screen printing Solder paste Three-dimensional integrated circuit Stencil Microtechnology Technology Electronics
30	SEMI-FINISHED BONDED SUBSTRATES: SOI-WAFER (SILICON ON INSULATOR) 1 Add to Reading List Source URL: www.enas.fraunhofer.de Language: English - Date: 2015-01-15 09:59:22 Semiconductor device fabrication Electronics manufacturing Wafer bonding Wafer Direct bonding Silicon on insulator Thermal oxidation Etching Eutectic bonding Microtechnology Electronics Materials science